创建连接：导电TPE
EC 系列和 EC/PA 系列是满足电导要求的材料解决方案
优势一览
无论是传感器、触摸屏的辅助操作还是残留电流的耗散设备，均可通过导电材料实现。
我们的专业知识 - 您的绝佳优势
该材料具有低电阻率和对聚丙烯或聚酰胺类树脂的良好包胶性。 根据IEC 61249-2-21，这些化合物不含卤素。 目前仅提供黑色材料。
- TPE材料具有出色的导电性
-
可达到不同的电阻率水平
» 电阻率 <103Ω cm
» 电阻率 <101Ω cm - 在多组分注塑中对聚酰胺类树脂的包胶
- 多组分注塑成型中对聚烯烃的粘合
- 封闭均匀的表面结构
- 热塑性加工
- 可在制造过程中回收利用
- 可供样本的材料：
» EC系列（包胶PP）
» EC / PA系列（包胶PA）
TPE的功能要求一直在不断提高。 不管现在和还是将来为了给客户提供更丰富的服务，避免产品过于单一，我们已经扩展了我们的产品组合，包括导电TPE。 我们的客户必将从我们一贯的高品质，优质的服务和定制产品中受益。
Johanna Schmid
Market Manager Industry
想要详细了解 TPE？
让我们为您的应用寻找最恰当的材料
瓦尔德克赖堡 - 德国
KRAIBURG TPE GmbH & Co. KG
雪兰莪 - 马来西亚
KRAIBURG TPE TECHNOLOGY (M) SDN.BHD.
乔治亚州布福德- 美国
KRAIBURG TPE Corporation
Creating Connections: Electrically Conductive TPE
The EC and EC/PA series are your material solutions for applications with requirements on electrical conductivity.
Your advantages
The materials come with low resistivity and good adhesion to polyolefines or polyamides. The compounds are halogenfree according to IEC 61249-2-21. They are available in black colors only.
- TPE material with excellent electrical conductivity
- Different levels of resistivity reachable
» Resistivity <103Ω cm
» Resistivity <101Ω cm - Adhesion to polyamides in multi-component injection molding
Key Features and Safety Standards
- Adhesion to polyolefins in multi-component injection molding
- Closed and uniform surface structure
- Thermoplastic processing
- In-process recycling possible
- Material available for sampling:
» EC series (Adhesion to PP)
» EC/PA series (Adhesion to PA)
Contact our Team of Experts
Reach out to us for comprehensive details into how we can positively impact your business.
The functional requirements for TPEs are increasing. To serve our customers now and in the future from a single source, we have expanded our portfolio to include electrically conductive TPEs. Our customers benefit from our usual high quality, our very good service and custom-engineered products.”
Johanna Schmid | Market Manager Industry
Download Fact Sheet
Fact sheets provide detailed information on solutions, areas of application, technical specifications, and product USPs.
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